DATE2025.05.31 #Press Releases
Realization of Micro Laser Processing for Next-Generation Semiconductor Glass Substrates
Summary
Researchers at the University of Tokyo (President: Teruo Fujii) have developed a micro laser drilling technology for glass substrate for semiconductor packaging. The EN-A1 glass substrate used in this research was provided by AGC Inc. and is considered a candidate material for the "post-process" of next-generation semiconductor manufacturing.
The newly developed method enables laser-only drilling of holes with diameters of less than 10 micrometers and an aspect ratio of around 20, achieving finer processing than conventional etching methods.
This result is expected to facilitate the transition of using glass as a material for circuit substrates in chiplet structures used in high-performance and data center computers that are needed for generative AI and other massive applications. The research group will continue to collaborate with industry to advance further miniaturization and quality improvement of semiconductor packaging substrates, contributing to enhancing Japan's competitiveness in the next-generation semiconductor industry.
Details of this work were presented at the ECTC 2025 international conference, which took place in Dallas, USA, from May 27 to 30, 2025.
Project Professor Hiroharu Tamaru of the Institute for Photon Science and Technology also participated in this research.
Micro laser drilling of holes in a semiconductor glass substrate
A deep ultraviolet laser was used to drill holes of less than 10 micrometers in diameter at 25-micrometer intervals in EN-A1 glass, which is considered a candidate substrate material for next-generation semiconductors.
Related Link
The Institute for Solid State Physics, The University of Tokyo
Journals
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Conference information ECTC (2025 IEEE 75th Electronic Components and Technology Conference)Title of paper